In the silver plating of ${\rm{Cu}},{\rm{\;K}}\left[ {{\rm{Ag}}{{\left( {{\rm{CN}}} \right)}_2}} \right]$ is used instead of ${\rm{AgN}}{{\rm{O}}_3}.$ The reason is:

Less availability of ${\rm{A}}{{\rm{g}}^ + }$ ion as ${\rm{Cu}}$ cannot displace ${\rm{Ag}}$ from ${\rm{Ag}}{\left( {{\rm{CN}}} \right)_2}$

A thin layer of ${\rm{Ag}}$ is formed on ${\rm{Cu}}$

$A{{\rm{g}}^ + }$ ions are completely removed from solution

NEET UG CHEMISTRY MCQ: CO-ORDINATION COMPOUNDS

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Understanding +4 | -1

In the silver plating of

\mathrm{Cu},\mathrm{\;K}\left[ {\mathrm{Ag}{{\left( {\mathrm{CN}} \right)}_2}} \right]

is used instead of

\mathrm{AgN}{\mathrm{O}_3}.

The reason is:

View answer and explanation

Correct option: D

Less availability of

\mathrm{A}{\mathrm{g}^ + }

ion as

\mathrm{Cu}

cannot displace

\mathrm{Ag}

from

\mathrm{Ag}{\left( {\mathrm{CN}} \right)_2}

Option D (Less availability of

\mathrm{A}{\mathrm{g}^ + }

ion as

\mathrm{Cu}

cannot displace

\mathrm{Ag}

from

\mathrm{Ag}{\left( {\mathrm{CN}} \right)_2}

) is correct because the complex ion

{\left[ {\mathrm{Ag}{{\left( {\mathrm{CN}} \right)}_2}} \right]^ - }

provides a lower concentration of free

Ag^+

ions, leading to a more uniform and adherent silver plating.